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Vertical Chips
The collapse of the memory wall
A breakthrough in chip architecture may redefine AI hardware. In 2025, researchers from Stanford, MIT, and Carnegie Mellon unveiled a monolithic 3D chip that stacks memory and logic vertically. This design bypasses the “memory wall” that has long throttled AI performance.
Unlike traditional 2D chips, the new prototype integrates computation and storage in ultra-dense layers, enabling faster data flow and reduced energy use. Manufactured in a U.S. foundry, it signals a new era of domestic semiconductor innovation. For AI systems demanding 1,000-fold performance gains, this is a foundational leap.
